SiP ShangHai

General Chair’s Welcoming Statement of SiP 2021

On behalf of the Organizing Committee, I am honored to invite you to SiP Conference China 2021, which will be held in Shanghai, China on May 21, 2021.

With the commercialization of 5G communication and artificial intelligence technology, System in Package(SiP) has ushered in a high-speed period for the development of industry due to its advantages of high performance, low power consumption and miniaturization. We have seen a lot of progress in SiP design, EDA, package testing and equipment materials. A variety of new solutions and advanced system integration methods have emerged in smartphones, the Internet of Things, wearable devices, data center, high-performance computing, automotive electronics and other terminal applications.

SiP Conference China is the most influential conference in the SiP industry in China. At this year's conference, we will provide you with a whole day of keynote speeches and technical speeches, covering the latest SiP technologies, market trends, best application cases and solutions from the whole industry chain of SiP, such as system companies, IC design companies, EDA companies, OSAT companies, equipment materials companies, etc.

Meanwhile, we also create a platform for communication and cooperation among peers from all aspects of the whole industry chain of System in Package. You can communicate fully and explore cooperation with industry experts in technology, market, application and other fields during the interval of the speech and the lunch.

We are looking forward to meeting you at SiP Conference China 2021 on May 21!

Feng Ling

Chairman of SiP Conference China 2021

Founder and CEO of Xpeedic co., LTD

20

Speakers

13

Exhibitors

564

Attendees

9000+

Webinar Attendees

The conference will cover the following vital topics

key topic

Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps.

SiP Business Market Progress and Technology

SiP Package Techology Innovation

SiP Materials and Equipment

SPEAKER

: General Chair: Feng LingFounder and CEO, Xpeedic Technology

Feng Ling is currently Founder and CEO of Xpeedic, a leading EDA software provider. Dr. Ling has over 20 years of industry experience in EDA, RF front end, and system-in-package spanning from Motorola, Neolinear, Cadence, Physware, to Xpeedic. Dr. Ling received his Ph.D. degree in electrical engineering from the University of Illinois at Urbana-Champaign (UIUC) in 2000. He is a Senior Member of IEEE. He has authored and co-authored 3 book chapters and more than 60 papers in refereed journals and conference proceedings.

SIP China Shanghai Station Agenda

Time: May 21,2021
Venue: Renaissance Shanghai Caohejing Hotel, China

May.21	Conference Room
9:00am - 9:30am	Registration and Networking
Session 1	SiP market update and frontier technology General Chair：Feng Ling, Founder and CEO, Xpeedic Co.,LTD
9:30am - 10:00am	SiP Technology Trends and Challenges for EDA Industry Feng Ling, Founder and CEO, Xpeedic Co.,LTD
10:00am - 10:30am	SiP Technology Application in Product Design of Wingtech Zhu Huawei, President and Vice President of Wingtech Research Institute, Wingtech Technology
10:30am - 11:00am	Advanced Packaging Technologies Promote MEMS Innovation Carlos Zhao, Senior Integration Manager for MEMS, Will Semiconductor Co., Ltd. Shanghai
11:00am - 11:30am	USI&ASE SiP Technology Roadmap Mike Zhao, AVP of SiP RD Center & Syste in Module BU, Universal Scientific Industrial (Shanghai) Co., Ltd.
11:30am - 12:00pm	Enabling SiP Technologies & Applications in Smart Terminals Rico Tian, Senior Director, Goertek Microelectronics Co. Ltd.
12:00pm - 12:30pm	Advanced Packaging Enabler for Highly Effective SiP and Heterogeneous Integration Jing Zhang, Head of Shanghai Innovation Center, Heraeus Electroncis China, Heraeus Materials Technology Shanghai Ltd
12:30pm - 01:30pm	Lunch Break & SiP Zone

May.21	Conference Room (A)
Session 2	Innovation in SiP assembly Technology Session Leader: Dr. Weiping Li, Guest Research Fellow, Shanghai Institute of Science and Technology Achievements Evaluation
01:30pm - 02:00pm	2.5D/3D system-in-package design and simulation process Hui Wang, AE Director, Cadence Design Systems Inc.
02:00pm - 02:30pm	5G Cellular RF Front-end Module Design and Package Trend Gu Jianzhong, COO, XinpleTek (Shanghai) Co., Ltd
02:30pm - 03:00pm	Problems and Challenges of AI/GPU Products in the Collaborative Design of Chips, Substrates and Systems Daniel Wen, R&D Director & Alchip Wuxi site GM,Alchip Technologies, Limited
03:00pm - 03:15pm	Coffee Break & Exhibit
03:15pm - 03:45pm	Are you ready for catch up the diversity of SiP design tool? Hongrun Li, Chief Representative, ZUKEN Inc.
03:45pm - 04:15pm	From Building up Data-Driven Smart Manufacturing to Leveraging Test Data for Whole Product Life Cycle Acceleration Min Tang, Principal Offering Manager, NI
04:15pm - 04:45pm	Development of SiP technology for RF module Daquan,Yu, GM, Sky Semiconductor
04:45pm - 05:00pm	Q&A

May.21	Conference Room (B)
Session 3	SiP Material & Equipment Session Leader: Russell Liu, VP, China Wafer Level CSP Co., Ltd.
01:30pm - 02:00pm	Advanced Placement Capability for Future SiP Production Ji Xu, SMT Solutions Product Marketing Manager, ASM Assembly Systems Ltd.
02:00pm - 02:30pm	Technical Challenges of SiP Packaging Equipment Jonathan Li, CTO, GuiLin LDZX Electronics Technology Co., Ltd.
02:30pm - 03:00pm	Weldtone adhesive material solutions in SiP Seven Lang, BD Manager, Xiamen Weldtone Technology Co.,Ltd.
03:00pm - 03:15pm	Coffee Break & Exhibit
03:15pm - 03:45pm	Material Challenges and Solutions for System-in-Package (SiP) Applications Danhui Gu, Henkel, Henkel AEE China Semiconductor TCS manager
03:45pm - 04:15pm	Fine Feature Solder Printing for SIP Leo Hu, Semiconductor Technical manager, Indium Corporation
04:15pm - 04:45pm	Enabling Heterogeneous Integration through Advanced Substrate Rozalia Beica, Head of Semiconductor Business Line, AT&S (China) Co., Ltd.
04:45pm - 05:00pm	Q&A