Shenzhen World Exhibition & Convention Center (Bao'an) | September 9-11, 2026
233 Days to Go
CN

Expo Introduction

elexcon 2026 will take place from September 9–11, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), co-located with CIOE – China International Optoelectronic Exposition. As the leading annual event for electronics and embedded technologies in South China, elexcon 2026 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technologies, MEMS sensors, power management ICs, power devices, industrial power supplies, passive components, and advanced packaging solutions including SiP and Chiplet. A series of professional forums will be held alongside the exhibition, including the Opening Keynote, the 8th China Embedded Technology Conference, the 10th SiP Conference China, the South China Automotive Electronics Sourcing & Procurement Matchmaking Event, and the Kaifa Gala · Greater Bay Area Developers Carnival. Together, these programs provide hardware developers, procurement managers, and decision-makers with a platform to gain early insights into emerging technologies and connect with new industry partners..

Highlights of the Exhibition

Scope of Exhibits

Embedded AI & Edge Computing (MCU, MPU, SoC, FPGA, DSP)

Embedded Modules

Development Boards

Embedded Operating Systems

Debugging & Simulation Tools

Compilers

Wired/Wireless Communication Modules

Sensors & Actuators

Power Management ICs

AIoT Solutions

Semiconductor IC / SoC / MCU / MPU

Power Supplies

Power Semiconductors

Test & Measurement

High-Speed Connectivity Technologies & Connectors

Wiring Harnesses, Cables & Components

Relays & Switches

Passive Components (Resistors, Capacitors, Inductors / Crystals)

MEMS & Sensors

Memory / Storage

PCB & Electronics Manufacturing Services (EMS)

Automotive Electronics

Optoelectronics & Display Technologies

SiP & Advanced Packaging

Contact Number:

+86 755 8831 1422