Shenzhen World Exhibition & Convention Center (Bao'an) | September 9-11, 2026
109 Days to Go
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Expo Introduction

elexcon 2026 will take place from September 9–11, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), co-located with CIOE – China International Optoelectronic Exposition. As the leading annual event for electronics and embedded technologies in South China, elexcon 2026 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technologies, MEMS sensors, power management ICs, power devices, industrial power supplies, passive components, and advanced packaging solutions including SiP and Chiplet. A series of professional forums will be held alongside the exhibition, including the Opening Keynote, the 8th China Embedded Technology Conference, the 10th SiP Conference China, the South China Automotive Electronics Sourcing & Procurement Matchmaking Event, and the Kaifa Gala · Greater Bay Area Developers Carnival. Together, these programs provide hardware developers, procurement managers, and decision-makers with a platform to gain early insights into emerging technologies and connect with new industry partners..
Highlights

5,000+ Exhibitors:Bringing together leading enterprises across the electronics, embedded systems, and photonics value chains, with exhibits spanning key components, system-level solutions, and application-ready technologies.

240,000+ Professional Visitors:Including 7,000+ international visitors from 97 countries and regions, representing consumer electronics, automotive, communications, data centers, medical, industrial, and IoT sectors, enabling efficient and targeted business connections.

100+ Concurrent Forums:Featuring 1,000+ industry experts and technical leaders, focusing on AI, electronics and embedded technologies, and optoelectronic communications, offering deep insights into technology trends and market opportunities.

Featured Conferences
The 7th Embedded Technology Conference China

-Edge Intelligence & Embedded AI Technologies

-Key Technologies for Robotics

-Memory Technology Forum

-Wireless Connectivity & Edge Networking Technologies

-Industrial Embedded Systems & Energy Management

The 9th SiP Conference China NEV Electronics Innovation Forum AI Compute Full-Stack Technology Forum
Special Focus Zones

Kaifa Gala – Engineers & Developers Carnival

-AI DevBoards: Innovation & Application Lab

-ELEXCON × EEFocus Teardown Show

SST (Solid-State Transformer) Zone

RISC‑V Ecosystem Zone

Scope of Exhibits

Embedded AI & Edge Computing (MCU, MPU, SoC, FPGA, DSP)

Embedded Modules

Development Boards

Embedded Operating Systems

Debugging & Simulation Tools

Compilers

Wired/Wireless Communication Modules

Sensors & Actuators

Power Management ICs

AIoT Solutions

Semiconductor IC / SoC / MCU / MPU

Power Supplies

Power Semiconductors

Test & Measurement

High-Speed Connectivity Technologies & Connectors

Wiring Harnesses, Cables & Components

Relays & Switches

Passive Components (Resistors, Capacitors, Inductors / Crystals)

MEMS & Sensors

Memory / Storage

PCB & Electronics Manufacturing Services (EMS)

Automotive Electronics

Optoelectronics & Display Technologies

SiP & Advanced Packaging

Contact Number:

+86 755 8831 1422